High Insulating Aluminum Nitride Ceramic Heat-sink

With the miniaturization and lightweight of electronic instruments and the significant increase in mixed integration, the amount of heat dissipation required per unit area on the substrate is increasing, especially in high-power circuits. Alumina ceramics are not sufficient to meet the thermal needs of ultra-high power due to their relatively poor thermal conductivity and the thermal conductivity at room temperature of about 15-35W/(m.K). In this case, people use the so-called composite structure substrate, in the high thermal density part of the use of zirconium oxide ceramic plate or molybdenum substrate, the other part is still used Alumina Ceramic Substrate, to meet the requirements of high thermal density. However, the composite structure substrate is not very satisfactory in terms of price, electrical performance and thermal performance, so it is urgent to develop Ceramic Substrate suitable for high integration, high thermal mixing integrated circuit. These factors led aluminum nitride ceramic substrates came into being. Aluminum nitride ceramic substrate is a new type to solve the problem of high thermal density, which is most suitable for ceramic substrates installed in semiconductor chips that is of the coefficient of thermal expansion is very similar to Si.

DBC Process Capability and Specification of DBC ceramic substrates

The prime advantages of DBC substrates

1. Great bonding strength between copper and ceramic: initial and after thermal cycling;  

2. High thermal conductivity,  the value of DBC ceramic substrate is up to 180W/k.m;

3. Exceptional hardness, flexural strength, compressive strength and fracture toughness;

4. Chemical stability, it won't react with almost acids and alkalis, free of rust forever;
5. High electrical insulation,  the insulation strength of ceramic substrate is up to 20KV;
6. High current handling capacity with selection of base layer of cooper; 

7. High heat dissipation, it can play a role of heat ceramic sink in the devices.

The recommendation of other types Metalized Ceramics 

The typical applications of DBC ceramic substrates

High-density Hybrid Circuits,   Microwave Power Devices, Power Semiconductor Devices, Power Electronic Devices, Optoelectronic  Components,Semiconductor Refrigeration Products

FAQs (Frequently Asked Questions)

Q1. Is it available to provide customize products?

A: We support customized DBC ceramic substrates with selection raw materials, designated thickness of DBC types. 
Q2. How long can I expect to get the sample?
A: The samples could be ready in 2 weeks when all technical details are confirmed.
Q3. How long does the whole procedure being worked out?
A: It depends on the quantity level of order. In common case, the manufacturing time is about 25 working days after order confirmed.
Q4. How to ensure quality?
A: The reliability test, dimensional & cosmetic inspection will be performed with a certain sampling size every order.

Q5. Do you supply other ceramic components?

A: Besides DBC ceramic substrates, we also produce a variety of Metallized Ceramic Insulator, high precision Zirconia Ceramic Component.

Q6. Are you a factory or trading company?
A: We are a professional manufacturer. We are warmly welcome clients from worldwide to visit our factory and cooperate with us.