Product Attributes

Model No.: Customized

Brand: Jinghui ceramics

Place Of Origin: China

Types Of: High Frequency Ceramics, Dielectric Ceramics, Insulating Ceramics

Material: Alumina, Zirconium Oxide, Aluminum Nitride, Silicon Nitride, 95% Alumina, Aln Ceramics

Tolerance: Best To Be 0.01mm

Min. Wall Thickness: 0.3mm

Precision Process: Fine Grinding,Maching,Laser Cutting

Features: Excellent Insulation, Heat Dissipation

Application: Ceramic Circuit Board

Certificate: Iso9001:2015, Sgs

Color: White, Gray

Supply Ability & Additional Information

Packaging: Export carton

Productivity: 100,000 sets/month

Transportation: Ocean,Land,Air,Express

Place of Origin: China

Supply Ability: 500,000 sets/month

Certificate: RoHS

HS Code: 8547100000

Port: Shenzhen,Hongkong

Packaging & Delivery

Selling Units:

Piece/Pieces

Package Type:

Export carton

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Direct Bonded Copper DBC Power Electronic Substrate

Direct Bonded Copper (DBC) is one of the main metallization technology for ceramic substrates. The copper foils can be directly bonded on single or double surfaces of ceramic base (Alumina Ceramic or aluminum nitride) without a middle layer, reducing the contact thermal resistance between the metal layer and the ceramic layer, getting better heat dissipcation capability.
DBC ceramic substrates have not only the features of high thermal conductivity, high electrical insulation, high mechanical strength, and low expansion of ceramics of ceramics, but also the high electrical conductivity and excellent soldering performance of oxygen-free copper, and can be carved into various graphics like a PCB circuit board.

Our factory have been producing a broad range of DBC ceramic substrates, mainly including high purity alumina ceramic DBC susbstrate, aluminum nitirde DBC substrate, beryllium oxide DBC substrate and silicon nitride DBC substrates. These substrates are commonly used in high power LED, solar cell component, thermoelectric (Peltier) coolers and semiconductor refrigeration fields .

DBC Process Capability and Specification of DBC ceramic substrates

S/N	Item	Parameters
1	Material type	96% alumina (Al2O3), Aluminum nitride(AlN) ,Beryllium oxide (BeO) and Silicon nitride(Si3N4)
2	Processing type	Direct Bonded Cooper (DBC)
3	Min. Distance	0.15mm
4	The thickness of conductor layer	0.075 ~ 600 um
5	Solder	White, Black, Green
6	Surface treatment	ENIPIG, Deposition
7	Typical thickness of raw substrate	0.30mm, 0.38mm, 0.50mm, 0.63mm and 0.80mm
8	Regular size	130mm x 140mm, 140mm x 190mm

The recommendation of other types Metalized Ceramics

Metalized Ceramic Insulator Customized Zirconia Metalized Ceramic Base Jpg Metallized Ceramic Cap Metallized Ceramic Rings

The typical applications of DBC ceramic substrates

High-density Hybrid Circuits, Microwave Power Devices, Power Semiconductor Devices, Power Electronic Devices, Optoelectronic Components,Semiconductor Refrigeration Products Application of ceramic substrate

FAQs (Frequently Asked Questions)

Q1. Is it available to provide customize products?

A: We support customized DBC ceramic substrates with selection raw materials, designated thickness of DBC types.
Q2. How long can I expect to get the sample?
A: The samples could be ready in 2 weeks when all technical details are confirmed.
Q3. How long does the whole procedure being worked out?
A: It depends on the quantity level of order. In common case, the manufacturing time is about 25 working days after order confirmed.
Q4. How to ensure quality?
A: The reliability test, dimensional & cosmetic inspection will be performed with a certain sampling size every order.

Q5: What other products are you dealing with?

A: We focus on a variety of technical Ceramic Tubes, Industrial Ceramic Plate, Ceramic Seals besides DBC ceramic substrates.

Q6. Are you a factory or trading company?
A: We are a professional manufacturer. We are warmly welcome clients from worldwide to visit our factory and cooperate with us.