Product Attributes

Model No.: Customized

Brand: Jinghui ceramics

Place Of Origin: China

Types Of: High Frequency Ceramics, Dielectric Ceramics, Insulating Ceramics

Material: Aluminum Nitride, Silicon Nitride, 95% Alumina, Aln Ceramics

Tolerance: Best To Be 0.01mm

Max. OD: 100mm

Min. Wall Thickness: 0.3mm

Precision Process: Fine Grinding,Maching,Laser Cutting

Features: Excellent Insulation, Heat Dissipation

Application: Ceramic Circuit Board

Certificate: Iso9001:2015, Sgs

Color: Gray

Supply Ability & Additional Information

Packaging: Export carton

Productivity: 100,000 sets/month

Transportation: Ocean,Land,Air,Express

Place of Origin: China

Supply Ability: 500,000 sets/month

Certificate: RoHS

HS Code: 8547100000

Port: Shenzhen,Hongkong

Packaging & Delivery

Selling Units:

Piece/Pieces

Package Type:

Export carton

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High Mechanical Strength IGBT AlN Ceramic Substrate

The prime advantages of DBC substrates

1.Thermal conductivity: 24~180 W/m.k (20~200 times of aluminum-based copper-clad substrate), dielectric withstand voltage 20 KV/mm (17 times of other circuit boards)

2. Conductor circuit bonding force ≥ 20N/cm2 (20 times that of other circuit boards), the surface roughness of the ceramic substrate is 0.2~0.7 um
3. Compressive strength ≥450MPa (compared to any traditional PCB), and in various harsh environments (high temperature, high humid, high pressure, high corrosion), it has good electrical performance.

The description of IGBT ceramic substrate

Aluminum nitride direct copper substrate has very high thermal conductivity in terms of thermal characteristics and fast heat dissipation; in terms of stress, the thermal expansion coefficient is close to that of silicon, and the internal stress of the entire module is lower, which improves the reliability of the high-voltage IGBT module. These excellent properties have made aluminum nitride DBC plates the first choice for high-voltage IGBT module packaging.

DBC Process Capability and Specification of DBC ceramic substrates

S/N	Item	Parameters
1	Material type	Aluminum nitride(AlN), 96% Alumina Ceramic (Al2O3) ,Beryllium oxide (BeO) and Silicon nitride(Si3N4)
2	Processing type	Direct Bonded Cooper (DBC)
3	Min. Distance	0.15mm
4	The thickness of conductor layer	0.075 ~ 600 um
5	Solder	White, Black, Green
6	Surface treatment	ENIPIG, Deposition
7	Typical thickness of raw substrate	0.30mm, 0.38mm, 0.50mm, 0.63mm and 0.80mm
8	Regular size	130mm x 140mm, 140mm x 190mm

The recommendation of other types Metalized Ceramics

Metalized Ceramic Insulator Customized Zirconia Metalized Ceramic Base Jpg Metallized Ceramic Cap Metallized Ceramic Rings

The typical applications of DBC ceramic substrates

High-density Hybrid Circuits, Microwave Power Devices, Power Semiconductor Devices, Power Electronic Devices, Optoelectronic Components,Semiconductor Refrigeration Products Application of ceramic substrate

FAQs (Frequently Asked Questions)

Q1. Is it available to provide customize products?

A: We support customized DBC ceramic substrates with selection raw materials, designated thickness of DBC types.
Q2. How long can I expect to get the sample?
A: The samples could be ready in 2 weeks when all technical details are confirmed.
Q3. How long does the whole procedure being worked out?
A: It depends on the quantity level of order. In common case, the manufacturing time is about 25 working days after order confirmed.
Q4. How to ensure quality?
A: The reliability test, dimensional & cosmetic inspection will be performed with a certain sampling size every order.

Q5. Do you supply other ceramic components?

A: Besides DBC ceramic substrates, we also produce a variety of Metalized Ceramic Insulator, high precision machined ceramic parts.

Q6. Are you a factory or trading company?
A: We are a professional manufacturer. We are warmly welcome clients from worldwide to visit our factory and cooperate with us.

Hig Power IGBT Aluminum Nitride Ceramic Substrate