High Mechanical Strength IGBT AlN Ceramic Substrate

The heat generated by the high-voltage and high-power IGBT module is mainly dissipated by conducting the ceramic direct bonded copper (DBC） substrate to the shell. Therefore, the DBC substrate is an indispensable key basic material for power module packaging in the power electronics field. It not only has the characteristics of technical ceramics such as high thermal conductivity, high electrical insulation, high mechanical strength, low expansion, etc., but also has the high conductivity of oxygen-free copper metal and excellent soldering performance, a variety of patterns can be etched easily on the substrate. The ceramic direct bonding copper substrate combine various advantages of power electronic packaging materials:
1) The ceramic part offers excellent thermal conductivity and pressure resistance;
2) The copper conductor possesses a very high current-carrying capacity;
3) It provides high adhesion strength and reliability between metal and ceramic;
4) It is easy to etch the designated pattern to form a circuit substrate;
5) It has excellent brazing performance, suitable for aluminum wire bonding to ceramic substrate directly.

Aluminum nitride direct copper substrate  has very high thermal conductivity in terms of thermal characteristics and fast heat dissipation; in terms of stress, the thermal expansion coefficient is close to that of silicon, and the internal stress of the entire module is lower, which improves the reliability of the high-voltage IGBT module. These excellent properties have made aluminum nitride DBC plates the first choice for high-voltage IGBT module packaging.

DBC Process Capability and Specification of DBC ceramic substrates

The prime advantages of DBC substrates

1. Exceptional hardness, flexural strength, compressive strength and fracture toughness;

2. Great metalization adhesion between copper and ceramic: initial and after thermal cycling;  

3. Chemical stability, it won't react with almost acids and alkalis, free of rust forever;
4. High electrical insulation,  the insulation strength of ceramic substrate is up to 20KV;
5. High thermal conductivity,  the value of DBC ceramic substrate is up to 180W/k.m;
6. High current handling capacity with selection of base layer of cooper; 

7. High heat dissipation, it can play a role of heat ceramic sink in the devices.

The recommendation of other types Metalized Ceramics 

The typical applications of DBC ceramic substrates

High-density Hybrid Circuits,   Microwave Power Devices, Power Semiconductor Devices, Power Electronic Devices, Optoelectronic  Components,Semiconductor Refrigeration Products

FAQs (Frequently Asked Questions)

Q1. Is it available to provide customize products?

A: We support customized DBC ceramic substrates with selection raw materials, designated thickness of DBC types. 
Q2. How long can I expect to get the sample?
A: The samples could be ready in 2 weeks when all technical details are confirmed.
Q3. How long does the whole procedure being worked out?
A: It depends on the quantity level of order. In common case, the manufacturing time is about 25 working days after order confirmed.
Q4. How to ensure quality?
A: The reliability test, dimensional & cosmetic inspection will be performed with a certain sampling size every order.

Q5. Do you supply other ceramic components?

A: Besides DBC ceramic substrates, we also produce a variety of Metalized Ceramic Insulator, high precision machined ceramic parts.

Q6. Are you a factory or trading company?
A: We are a professional manufacturer. We are warmly welcome clients from worldwide to visit our factory and cooperate with us.