Thick Flim DBC Alumina Ceramic Substrate

Thick film metal is a cost-efficient and ideal solution to your pattered metallization needs. This technology can be realized through DBC on ceramic substrates. DBC, also is known as direct bonded copper, means the copper layer and the ceramic bold material directly bonded together. DBC Ceramic Substrate has been proven for ages as a proper solution for electrical insulation and thermal management of high power modules.  

Our facility supply a wide range of direct bonded cooper (DBC) ceramic substrates, mainly including high purity Alumina Ceramic DBC susbstrate, aluminum nitirde DBC substrate,  beryllium oxide DBC substrate and silicon nitride DBC substrates. These substrates are commonly used in high power modules due to their high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic.

By varying copper and ceramic thickness can affect a resulting CTE value of total system of power modules, so we are capable of dealing with a selection of thickness of cooper range from  0.075 micrometers to 600 micrometers, also the typical thickness of ceramic plates include 0.30mm, 0.38mm, 0.50mm, 0.635mm and 0.80mm.

DBC Process Capability and Specification of DBC ceramic substrates

The prime advantages of DBC substrates

1. Great metalization adhesion between copper and ceramic: initial and after thermal cycling;  

2. Exceptional hardness, flexural strength, compressive strength and fracture toughness;

3. Chemical stability, it won't react with almost acids and alkalis, free of rust forever;
3. High electrical insulation,  the insulation strength of 96% al2o3 ceramic substrate is up to 20KV;
4. High thermal conductivity,  the value of 96% alumina is betwwen 24W/k.m to 28W/k.m;
5. High current handling capacity with selection of base layer of cooper; 

6. High heat dissipation, it can play a role of heat ceramic sink in the devices.

The recommendation of other types Metalized Ceramics 

The typical applications of DBC ceramic substrates

High-density Hybrid Circuits,   Microwave Power Devices, Power Semiconductor Devices, Power Electronic Devices, Optoelectronic  Components,Semiconductor Refrigeration Products

FAQs (Frequently Asked Questions)

Q1. Is it available to provide customize products?

A: We support customized DBC ceramic substrates with selection raw materials, designated thickness of DBC types. 
Q2. How long can I expect to get the sample?
A: The samples could be ready in 2 weeks when all technical details are confirmed.
Q3. How long does the whole procedure being worked out?
A: It depends on the quantity level of order. In common case, the manufacturing time is about 25 working days after order confirmed.
Q4. How to ensure quality?
A: The reliability test, dimensional & cosmetic inspection will be performed with a certain sampling size every order.

Q5. Do you supply other ceramic components?

A: Besides DBC ceramic substrates, we also produce a variety of Metalized Ceramic Insulator, high precision machined ceramic parts.

Q6. Are you a factory or trading company?
A: We are a professional manufacturer. We are warmly welcome clients from worldwide to visit our factory and cooperate with us.