Min. Order:100 Piece/Pieces
Transportation:Ocean,Land,Air,Express
Port:Shenzhen,Hongkong
$5≥100Set/Sets
Model No.: Customized
Brand: Jinghui ceramics
Place Of Origin: China
Types Of: High Frequency Ceramics, Dielectric Ceramics, Insulating Ceramics
Material: Alumina, Zirconium Oxide, Aluminum Nitride, Silicon Nitride, 95% Alumina, Aln Ceramics
Color: White
Tolerance: Best To Be 0.01mm
Max. OD: 100mm
Min. Wall Thickness: 0.3mm
Precision Process: Fine Grinding,Maching,Laser Cutting
Features: Excellent Insulation, Heat Dissipation
Application: Ceramic Circuit Board
Certificate: Iso9001:2015, Sgs
Packaging: Export carton
Productivity: 100,000 sets/month
Transportation: Ocean,Land,Air,Express
Place of Origin: China
Supply Ability: 500,000 sets/month
Certificate: RoHS
HS Code: 8547100000
Port: Shenzhen,Hongkong
Our facility supply a wide range of direct bonded cooper (DBC) ceramic substrates, mainly including high purity Alumina Ceramic DBC susbstrate, aluminum nitirde DBC substrate, beryllium oxide DBC substrate and silicon nitride DBC substrates. These substrates are commonly used in high power modules and large-scale integrated (LSI) packages due to their high thermal conductivity, high current capacity and heat dissipation of the high-purity copper on ceramic.
By varying copper and ceramic thickness can affect a resulting CTE value of total system of power modules, so we are capable of dealing with a selection of thickness of cooper range from 0.075 micrometers to 600 micrometers, also the typical thickness of ceramic plates include 0.30mm, 0.38mm, 0.50mm, 0.635mm and 0.80mm.
DBC Process Capability and Specification of DBC ceramic substrates
S/N Item Parameters 96% alumina (Al2O3), Aluminum nitride(AlN) ,Beryllium oxide (BeO) and Silicon nitride(Si3N4) 2 Processing type Direct Bonded Cooper (DBC) 3 Min. Distance 0.15mm 4 The thickness of conductor layer 0.075 ~ 600 um 5 Solder White, Black, Green 6 Surface treatment ENIPIG, Deposition 7 Typical thickness of raw substrate 0.30mm, 0.38mm, 0.50mm, 0.63mm and 0.80mm 8 Regular size 130mm x 140mm, 140mm x 190mm
1 Material type
1. Great metalization adhesion between copper and ceramic: initial and after thermal cycling;
2. Exceptional hardness, flexural strength, compressive strength and fracture toughness;
3. Chemical stability, it won't react with almost acids and alkalis, free of rust forever;
3. High electrical insulation, the insulation strength of 96% al2o3 ceramic substrate is up to 20KV;
4. High thermal conductivity, the value of 96% alumina is betwwen 24W/k.m to 28W/k.m;
5. High current handling capacity with selection of base layer of cooper;
6. High heat dissipation, it can play a role of heat ceramic sink in the devices.
High-density Hybrid Circuits, Microwave Power Devices, Power Semiconductor Devices, Power Electronic Devices, Optoelectronic Components,Semiconductor Refrigeration Products
Q1. Is it available to provide customize products?
A: We support customized DBC ceramic substrates with selection raw materials, designated thickness of DBC types.
Q2. How long can I expect to get the sample?
A: The samples could be ready in 2 weeks when all technical details are confirmed.
Q3. How long does the whole procedure being worked out?
A: It depends on the quantity level of order. In common case, the manufacturing time is about 25 working days after order confirmed.
Q4. How to ensure quality?
A: The reliability test, dimensional & cosmetic inspection will be performed with a certain sampling size every order.
Q5. Do you supply other ceramic components?
A: Besides DBC ceramic substrates, we also produce a variety of Metalized Ceramic Insulator, high precision machined ceramic parts.
Q6. Are you a factory or trading company?
A: We are a professional manufacturer. We are warmly welcome clients from worldwide to visit our factory and cooperate with us.