Home> Products> Advanced Ceramic Plate> Ceramic Substrate> 0.5mm 1mm Thick Aluminum Nitride AlN Ceramic Plate
0.5mm 1mm Thick Aluminum Nitride AlN Ceramic Plate
0.5mm 1mm Thick Aluminum Nitride AlN Ceramic Plate
0.5mm 1mm Thick Aluminum Nitride AlN Ceramic Plate

0.5mm 1mm Thick Aluminum Nitride AlN Ceramic Plate

Payment Type:T/T,Paypal,Money Gram,Western Union

Incoterm:FOB,CFR,CIF,EXW,FCA,CPT,CIP

Min. Order:1 Piece/Pieces

Transportation:Ocean,Land,Air

Port:Shenzhen,HongKong

Product Description
Product Attributes

Model No.Standard or custom-made

BrandJinghui ceramics

Supply Ability & Additional Information

PackagingExport carton

Productivity100000 pieces/month

TransportationOcean,Land,Air

Place of OriginChina

Supply Ability50000 pieces/month

CertificateRoHS

HS Code8547100000

PortShenzhen,HongKong

Payment TypeT/T,Paypal,Money Gram,Western Union

IncotermFOB,CFR,CIF,EXW,FCA,CPT,CIP

Packaging & Delivery
Selling Units:
Piece/Pieces
Package Type:
Export carton

0.5mm 1mm Thick Aluminum Nitride AlN Ceramic Plate

The description of the AlN ceramic plate

AlN ceramic plate is one of the most popular technical Ceramic Substrate which offer exceptional thermal conductivity,  excellent heat resistance, high mechnical strength , abrasion resistance and small dielectric loss . The surface of AlN plate is very smooth free of porosity . The thermal conductivity of aluminum nitride , compared to alumina substrate , It is about 5 to 9 times high . AlN ceramic plate, substrate and wafer are an ideal electronic package materials . 

The specification of the AlN ceramic plate
1. We are supplying with many round ceramic wafer, square & rectangular ceramic substrate
2. The typical thickness of wafer covers 0.38mm, 0.5mm, 0.635mm, 1.0mm, 1.2mm, 1.5mm
3. The biggest diameter of round ceramic wafer can be up to 400mm in 3mm, 4mm, 5mm thick
4. The max. side-length of square and rectangular ceramic wafer can be 400mm by 500mm
5. Surface treatment: it can be one-side, or double side polished, metalizing or sand blasting

6. Typical specification checklist of Aln ceramic plate as below:

S/N

Thickness  (Unit:mm)

Size (Unit:mm)
1 0.38

50.8 x 50.8mm,  76.2 x 76.2mm


101.6 x 101.6mm, 110 x 110mm


114.3 x 114.3mm, 127 x 127mm


Above sizes are with all standard thickness

2 0.50
3 0.635
4 1.0
5 1.2
6 1.5

The main features of the AlN ceramic plate
1. High thermal conductivity (170 ~220) W/m.k,  it's 5~8.5 times higher than that of alumina
2. Similar coefficient of thermal expansion to that of silicon (Si), it helps to achieve high reliability of Si chip
3. High insulation resistance and voltage resistance strength, but low dielectric constant and dielectric loss
4. High mechanical strength, it's up to 450MPa and very dense ceramic body free of porosity
5. It offers very high purity up to 99%, also it's free of toxicity and meets RoHS, REACH regulation

The application of the AlN ceramic plate
AlN plate, wafer and substrate is an excellent electronic package material, AlN substrate for a wide range of applications, 
including thin film and thick film microelectronic , high power and high frequency circuit RF / microwave components and capacitor or resistor

Related products of AlN ceramic wafers

AlN Ceramic wafer  Alumina ceramic substrate  Si3N4 Ceramic Substrate


Remark: 

We supply a broad range of ceramic wafers, including Alumina Ceramic wafer, zirconia ceramic wafer, 

silicon nitride ceramic wafer, aluminum nitride ceramic wafer and so on.


Property Datasheet of AlN Ceramic Wafers and Ceramic Substrates

General
Properties
Unit 
Value
Mechanical
Purity 
% ≥99
Volume Density
g/cm3
≥3.30
Color
Gray
Porosity
% 0
Compressive Strength
MPa -
Bending Strength
MPa 450
Elastic Modulus
MPa 330
Fracture toughness
Mpam1/2 3
Thermal
Max. service temperature (Non-loading)

1800
Thermal Conductivity (25℃)
W/m.k
≥170
Coefficient of Thermal Expansion (CTE)
1*10-6 m/k
4.6
Specific heat
1 x 103J/(kg·K)
0.74
Electrical
Volume Resistivity (25℃)
ohm.cm
1*1014
Insulation Breakdown
KV/mm
25
Dielectric constant (1Mhz)
(E)
8.7

Production capability and our strength for ceramic wafers

1. Vacuum Hot Pressed Sintering Furnace

Vacuum Hot Press Sintering

2. High Precision Machining Capability 

High Precision Machining

3. CNC machining Workshop

CNC Machining

4. Customized capability from small size to big-size

Customized Production Capability

Remark:

We have own in-house comprehensive types of manufacturing equipment, including forming machines, 

vacuum sintering furnace, High precision machining equipment, polishing machines, metalizing production lines.


Inspection and Quality-control Capability for ceramic wafers

1. High Precision Inspection Tools

High Precision InspectionInspection Equipment

2. OQC Inspection Workshop

Inspection

Remark:

1. We have complete and rigorous quality-control system, including IQC, IPQC, QA and OQC per ISO9001.

2. We also have professional quality assurance team and precision inspection equipments for quality-control.


FAQs (Frequently Asked Questions)

Q1:Is it available to provide customized products?

A: We always support custom-made demand as per different dimensions, design and surface treatment. 

Q2. When can I get the price?

A: We regularly quote within 24 hours after we get your inquiry. If you are in urgent need of get the price, 

please call us or tell us in your email so that we will proceed your inquiry as priority. 

Q3. How long can I expect to get the sample?

A: After you pay the sample charge and send us the confirmed files, the samples will be ready for delivery in 4 weeks. 

Q4:How long does the whole procedure being worked out?

A: After you place an order, the manufacturing time is about 25 working days. 

Q5. Are you a factory or trading company?

A: We are a professional manufacturer. You are welcome to visit our factory.

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